Wafer packaging machine

Wafer packaging machine

Location:Germany

Available quantity:99

Description

Main Performance and Structural Features

  1. Dual Frequency Converter Control – Bag length can be set and cut instantly without the need for adjustment or empty running, saving both time and film.
  2. User-Friendly Interface – Human-machine interface for quick and convenient parameter setting.
  3. Automatic Fault Diagnosis – Self-diagnosis function with clear fault display for easy troubleshooting.
  4. High-Sensitivity Color Mark Tracking – Photoelectric eye tracking combined with digital sealing and cutting position input ensures highly accurate sealing and cutting.
  5. Independent PID Temperature Control – Provides optimal adaptability for a wide range of packaging materials.
  6. Stop Positioning Function – Prevents film sticking and eliminates film waste.
  7. Simplified Rotation System – Offers greater operational reliability and easier maintenance.
  8. Software-Controlled Functions – All controls are managed via software, enabling easy function adjustments, technology upgrades, and keeping the system up-to-date.

Scope of Application

Suitable for packaging a variety of regular-shaped items, including:

  • Biscuits, rice cakes, snow cakes, egg yolk pies, chocolate, bread, instant noodles, moon cakes
  • Medicines, daily necessities, industrial parts
  • Cartons or tray-packed products


Specifications

ManufacturerGLOBAL TECHNICAL SOLUTIONS
Year2025
ConditionNew
Stock Number.